Press Release
For Immediate Release
Temperature Monitoring Wafers for the Semiconductor Industry
for improved quality and yield
(West Chester, PA) --- Designed specifically to improve semiconductor wafer manufacturing processes, new temperature-monitoring Thermocouple Wafers from CGS Thermodynamics are economical and easy to use. The proprietary technology, developed in conjunction with IBM Corp., allows process teams to obtain real-time, extremely accurate temperature profiles of product and equipment, from stable state through ramping up, process, and cool-down phases. With this data, they can characterize and fine-tune process conditions for better product yield and throughput in new tool installations, and resulting in faster turn-around time from down periods, such as preventive maintenance, clean-outs, and tool changes.
The CGS Thermodynamics Thermocouple Wafers are accurate to +/- 0.5% of actual temperatures, and are rugged and tolerant to thermal shock and extreme handling demands. Operational from 0o to 1100o C., from ambient to high-vacuum conditions.
A proprietary adhesion method enables the thermocouple wafer to measure accurate temperatures on bare, coated, and device-patterned substrates. It also prevents any degradation of the thermocouple element, further ensuring accuracy.
The Thermocouple Wafers are calibrated using a Hewlett Packard computerized precision system, which is traceable to NIST (National Institute of Standards and Technology). Available as individual wafers or as complete assemblies, including extension leads and terminations (plugs, jacks, etc.) Multi-sensor wafers have thermocouple-to-thermocouple matching of less than 0.1o C.
Custom Thermocouple Wafers are fabricated and calibrated to customer specifications, with calibration temperature points ranging from 0o to 1100o C. Thermocouple Wafer wire insulation is offered in a variety of materials and connector types for adaptability to particular processing requirements.
Complete data acquisition systems are available for easy turn-key operation where graphs and tables of temperature, voltage, and time are required (both hand-held and full-size units). Full-size units provide feedback signal for temperature control systems.
CGS Thermodynamics Thermocouple Wafers will also help R&D teams to develop processes with a better understanding of true wafer temperature, resulting in shorter qualification times. Manufacturers of wafer processing equipment will also use the technology for quality control purposes.
For further information, Circle Reader service # , or contact CGS Thermodynamics, 123 Willowbrook Lane, West Chester, PA 19382. Phone: (800)523-2002. Fax: (610) 430-1325.
The CGS Thermodynamics Thermocouple Wafers are accurate to +/- 0.5% of actual temperatures, and are rugged and tolerant to thermal shock and extreme handling demands. Operational from 0o to 1100o C., from ambient to high-vacuum conditions.
A proprietary adhesion method enables the thermocouple wafer to measure accurate temperatures on bare, coated, and device-patterned substrates. It also prevents any degradation of the thermocouple element, further ensuring accuracy.
The Thermocouple Wafers are calibrated using a Hewlett Packard computerized precision system, which is traceable to NIST (National Institute of Standards and Technology). Available as individual wafers or as complete assemblies, including extension leads and terminations (plugs, jacks, etc.) Multi-sensor wafers have thermocouple-to-thermocouple matching of less than 0.1o C.
Custom Thermocouple Wafers are fabricated and calibrated to customer specifications, with calibration temperature points ranging from 0o to 1100o C. Thermocouple Wafer wire insulation is offered in a variety of materials and connector types for adaptability to particular processing requirements.
Complete data acquisition systems are available for easy turn-key operation where graphs and tables of temperature, voltage, and time are required (both hand-held and full-size units). Full-size units provide feedback signal for temperature control systems.
CGS Thermodynamics Thermocouple Wafers will also help R&D teams to develop processes with a better understanding of true wafer temperature, resulting in shorter qualification times. Manufacturers of wafer processing equipment will also use the technology for quality control purposes.
For further information, Circle Reader service # , or contact CGS Thermodynamics, 123 Willowbrook Lane, West Chester, PA 19382. Phone: (800)523-2002. Fax: (610) 430-1325.